
Package Outline
TSLP-2-17 (mm)
ESD5V3S1U-02LRH
Top view
-0.03
0.39 +0.01
Bottom view
0.05 MAX.
0.6 ±0.05
2
2
1
Cathode
1
0.5 ±0.035 1)
marking
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BAR90-02LRH
Type code
Cathode marking
Laser marking
Standard Packing
Reel ?180 mm = 15.000 Pieces/Reel
Reel ?330 mm = 50.000 Pieces/Reel (optional)
Cathode
marking
4
0.76
0.5
6
2011-06-17